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| FEDL7012-04-01 1 Semiconductor ML7012-04 2400 bps Single Chip Full Duplex Data Modem with Protocol This version: Sep. 2000 GENERAL DESCRIPTION The ML7012-04 is a single chip modem LSI device that enables data communication conforming to ITU-T recommendations V.22bis, V.22, and V.21. This device is equipped with the error correction protocol function conforming to MNP Class 4. (The MNP Class 4 can be used for V.22bis or V.22.) The ML7012-04 consists of high speed DSP, analog front end, and digital logic circuit. In addition, this device provides local analog loop testing, synchronous/asynchronous switching, dialing, and auto answering functions. The ML7012-04 has a serial interface as an external interface. When integrated into the system, it is controlled from a control CPU through a serial interface (e.g. UART). By connecting a level converter, the ML7012-04 can easily implement a modem that can be controlled through the RS-232C interface. FEATURES * Conforming to ITU-T Recommendations V.22 bis, V.22, and V.21: Asynchronous * Error correction function conforming to MNP Class 4 * Serial interface: V.24 interface * AT commands (excluding automatic command speed detection) * Terminal data speed between DTE and DCE: 9600 bps, 2400 bps, 1200 bps, 300 bps * Character format: 10 bit/character * DTMF sending function * Pulse-dial control signal output * Call progress tone * Auto answering function * Built-in electronic HYB circuit (a line transformer can be directly coupled) * Single +3 V power supply * Power consumption: Typ. = 35 mA (VDD = 3.3 V) * Package: 64-pin plastic QFP (QFP64-P-1414-0.80-BK) (Product name: ML7012-04GA) * MNP is a registered trademark of Microcom Inc. 1/22 FEDL 7012-04-01 1 Semiconductor ML7012-04 BLOCK DIAGRAM RLY2 RLY1 RTS CTS DCD DSR DTR Control section CI STD SRD SPEED1, 0 PDN/RST OSC0 OSC1 To each section SG Gen. Clock generation GSR SG UART Tone generation - + AOUT Modulation/ demodulation AFE RCI - + RCAO TXAI TXAN - + TXAP Tone detection - + AIN TST2 to 0 TI8 to 0 TO10 to 0 VDD2, 1 GND2, 1 SPK RII VDDA GNDA 2/22 FEDL 7012-04-01 1 Semiconductor ML7012-04 PIN CONFIGURATION (TOP VIEW) GNDA 50 GND2 RLY2 RLY1 GSR SRD STD CTS RTS TO8 VDD2 AIN SG NC 64 63 62 61 60 59 58 57 56 55 54 53 52 NC DSR DCD TO9 TO10 DTR CI TI8 TO0 TO1 TO2 SPEED1 SPEED0 TI0 TI1 NC 51 49 NC RII 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 48 47 46 45 44 43 42 41 40 39 38 34 36 35 34 33 TXAP TXAN TXAI RCAO RCI AOUT VDDA OSC1 OSC0 TI7 TI6 TI5 NC PDN/RST TST0 NC NC 17 TI2 18 TI3 19 VDD1 20 TI4 21 SPK 22 TO3 23 TO4 24 NC 25 TO5 26 TO6 27 TO7 28 TST2 29 TST1 30 GND1 31 64-Pin Plastic QFP Note: Pins marked (NC) are no-connection pins which are left open. NC 32 3/22 FEDL 7012-04-01 1 Semiconductor ML7012-04 PIN DESCRIPTIONS System & Clock Symbol OSCO OSC1 I/O I O Description Pins to connect crystal, resistors and capacitors for the master clock oscillation. When supplying the master clock from an external source, use OSC0 and leave OSC1 open. Master clock frequency = 11.0592 MHz. When PDN/RST = "0", OSC1 = "1". Power-down and reset control input pin. When PDN/RST = "0", this device is in the power-down state and internal circuits are reset. "0": Power-down state, "1": Normal operation PDN/RST After power-on, use this pin after setting it to "0" for 1 s or more to reset internal circuits. Waiting for 230 ms or more is required until restarting a normal operation after reset release. If this pin remains at "0" after power-on, the internal circuits become undefined and the power-down current may increase. To avoid this, input "1" to this pin and start oscillation or input the master clock to operate the internal circuits, and then set it to "0" I V.24 Serial Interface Symbol STD SRD RTS CTS DCD DSR DTR CI I/O I O I O O O I O Description Send data input pin Receive data output pin When PDN/RST = "0", SRD outputs "1". RTS (Request to Send) signal input pin CTS (Clear to Send) signal output pin When PDN/RST = "0", CTS outputs "1". DCD (Data Carrier Detect) signal output pin When PDN/RST = "0", DCD outputs "1". DSR (Data Set Ready) signal output pin When PDN/RST = "0", DSR outputs "1". DTR (Data Terminal Ready) signal input pin CI (Calling Indicator) signal output pin (*2) When PDN/RST = "0", CI outputs "1". 0: Space, 1: Mark 0: Space, 1: Mark 0: On, 1: Off 0: On, 1: Off 0: On, 1: Off 0: On, 1: Off 0: On, 1: Off 0: On, 1: Off 4/22 FEDL 7012-04-01 1 Semiconductor ML7012-04 Analog Interface Symbol AOUT RCI RCAO TXAI TXAN TXAP AIN GSR SG I/O O I O I O O I O O Transmit analog output pin When PDN/RST = "0", AOUT is in a high impedance state. Operational amplifier input pin constituting transmit RC active Operational amplifier output pin constituting transmit RC active When PDN/RST = "0", RCAO is in a high impedance state. Input pin of the line transformer drive amplifier Output pin of the line transformer drive amplifier (1) When PDN/RST = "0", TXAN is in a high impedance state. Output pin of the line transformer drive amplifier (2) When PDN/RST = "0", TXAP is in a high impedance state. Input pin of the receive input amplifier Output pin of the receive input amplifier When PDN/RST = "0", GSR is in a high impedance state. Pin to connect capacitors for the SG circuit When PDN/RST = "0", SG is in a high impedance state. Description PSTN Line Control Interface Symbol I/O Description Off-hook and pulse dial control signal output pin (*1) RLY1 O 0: On-hook or break state of pulse dial 1: Off-hook or make state of pulse dial When PDN/RST = "0", RLY1 outputs "0". The control signal output pin to disconnect interlinked telephones (*1) RLY2 O 0: PSTN is connected with interlinked telephones 1: PSTN is disconnected with interlinked telephones but connected with modem When PDN/RST = "0", RLY2 outputs "0". Incoming signal input pin (*2) RII I Input "0" while detecting an incoming signal Input "1" while not detecting an incoming signal Fix this pin to "1" when a ring detector is not used. Speaker control signal output pin SPK O 0: speaker On 1: speaker Off When PDN/RST = "0", SPK outputs "1". 5/22 FEDL 7012-04-01 1 Semiconductor ML7012-04 Other Interface Symbol I/O Speed 1 0 0 Speed 0 I 1 1 Description Data Transmission Speed between DTE and DCE Speed 1 I Speed 0 0 1 0 1 Speed 300 bps 1200 bps 2400 bps 9600 bps Test Interface Symbol TST2 to 0 TI8 to 0 TO10 to 0 I/O I I O Input "0". Input "0". Leave open. Description Power Supply Symbol VDDA GNDA VDD2 to 1 GND2 to 1 I/O I I I I Analog VDD pin Analog GND pin Digital VDD pin Digital GND pin Description (*1) Pre-pause RLY1 Dialing Communicating Command RLY2 Line Connection (*2) RII 150 ms CI One incoming signal 400 ms 6/22 FEDL 7012-04-01 1 Semiconductor ML7012-04 Absolute Maximum Ratings Parameter Power Supply Voltage Analog Input Voltage Digital Input Voltage Power dissipation Output short-circuit current Storage Temperature Symbol VDD VAIN VDIN PD VOUT TSTG Rating -0.3 to +5.0 -0.3 to VDD +0.3 -0.3 to VDD +0.3 to 500 to 90 -55 to +150 Unit V V V mW mA C Recommended Operating Conditions Parameter Power Supply Voltage Operating Temperature High Level Input Voltage Low Level Input Voltage Digital Input Rise time Digital Input Fall Time Input Clock Frequency Deviation Master CLK Duty Digital Output Load R1 to R3 Resistance Ratio (R3/R1) R4 to R5 Resistance Ratio (R5/R4) SG Bypass Capacitor Oscillator Feedback Resistance OSC0 and OSC1 Load Capacitance Oscillation Frequency Frequency Deviation Crystal Equivalent Series Resistance *1 Load Capacitance *1 Symbol VDD TOP VIH VIL tir tif FMCK DMCK CDL Rrat1 Rrat2 Rrat3 CSG ROSC C01, C02 -- -- Condition -- -- All digital input pins excluding OSC0 All digital input pins 11.0592 MHz Input to OSC0 Digital output pin -- VDD 3 V VDD 2.7 V SG pin Between OSC0 and OSC1 OSC0 and OSC1 pins -- Including temperature characteristics -- Min. 2.7 -20 0.7 x VDD 0 -- -- -100 40 -- -- -- -- 1 800 -- -- -80 Typ. -- +25 -- -- -- -- -- 50 -- 1 -- -- -- 1000 15 11.0592 -- Max. 3.6 +70 VDD 0.16 x VDD 20 20 +100 60 50 1.05 2 1.6 -- 1200 -- -- +80 Unit V C V V ns ns ppm % pF -- -- -- F k pF MHz ppm -- -- -- 90 -- -- -- 12 -- pF *1: If the crystal manufacturer's evaluation is sufficiently verified, the values of equivalent series resistance and load capacitance may be changeable so long as the frequency deviation is within the range specified above. 7/22 FEDL 7012-04-01 1 Semiconductor ML7012-04 ELECTRICAL CHARACTERISTICS DC Characteristics (VDD = 2.7 to 3.6 V, Ta = -20 to +70C) Min. Typ. Max. Unit -- -- -- -- -- -- 35 1 0 0 0.1 5 65 1000 20 20 -- 0.4 -- mA A A A V V pF Parameter Power Supply Current Input Leakage Current High Level Digital Output Voltage Low Level Digital Output Voltage Input Capacitance Symbol IDO IDDS IIH IIL V0H V0L CIN Condition -- Power-down mode *1 VI = VDD VI = 0 V I0H = -0.4 mA I0L = 3.2 mA -- 0.8 x VDD 0.99 x VDD *1: In the case where the device is powered down after once activated. 8/22 FEDL 7012-04-01 1 Semiconductor ML7012-04 Analog Interface (VDD = 2.7 to 3.6 V, Ta = -20 to +70C) Min. Typ. Max. Unit -- 20 1080 -- 1.3 -- -19.5 -17.0 -16.0 -1.5 -20 -10 -- -- -- -46 -46 -- 10 -- -- -- 1.4 30 -18.0 -15.5 -14.5 -- -18.0 -- -- -- -- -- -- -- 25 15 -- -- -50 -50 -- -- -- 100 1.65 -- -16.0 -13.5 -12.5 +1.5 -15.5 +10 -20 -40 -60 -15 -- -54 -- -- -- -- -- -- M k pF V k dBm dBm dBm % dBm Hz dBm dBm dBm dBm dBm dBm ms ms dBm dBm dBm dBm Parameter Input Resistance Output Load Resistance Output Load Capacitance SG Output Voltage SG Output Impedance Carrier Output Level DTMF Low Group Output Level DTMF High Group Output Level DTMF Output Frequency Precision Answer Tone Output Level Answer Tone Output Frequency Precision Symbol RIN RL1 RL2 CL VSG RSG VAOM VDTL VDTH TSDF VAOAT TSAF VS1 VS2 Condition RCI, TXAI, AIN AOUT, RCAO, GSR Between TXAN and TXAP Analog output SG SG AOUT, S34 = 0 dm AOUT, S35 = 0 dm AOUT, S35 = 0 dm Against a nominal frequency AOUT, S34 = 0 dB Against 2100 Hz 4 to 8 kHz TXAN, TXAP 8 to 12 kHz 12 kHz or more (each 4 kHz band) GSR level GSR level *2 -- -- OFF ON ON OFF OFF ON ON OFF GSR level GSR level Undesired Sending Level VS3 Carrier Receive Input Level Carrier Detection Level Carrier Detection Delay Time Carrier Detection Hold Time Answer Tone Detection/Nondetection Level Call Progress Tone Detection/Non-detection Level VGSR VON VOFF tCDD tCDH ATDL CPDL *1: The unit of the signal level (dBm) is 0 dBm = 0.775 Vrms. *2: The values of the carrier detection level are those for QAM, PSK and FSK modulation signals. 9/22 FEDL 7012-04-01 1 Semiconductor ML7012-04 COMMAND DESCRIPTIONS AT Commands (1) Command format AT commands begin with AT Characters CR LF However, the commands of A, D, Dc, On, Zn, Ax, &Tn and &Zn must be set at the end of the sequence of commands. Any commands set after those commands are ignored. The maximum command character string is 40 characters (space <20h> is ignored). Input characters can be deleted by a backspace function (a cord is changeable). Start Bit 1 1 1 1 Data Bit 7 7 7 8 Parity None Odd number Even number None Stop Bit 2 1 1 1 Character Length 10 10 10 10 10/22 FEDL 7012-04-01 1 Semiconductor ML7012-04 (3) AT command list It is regarded that n = 0 when the parameter is not specified to the command with parameter (n). CMD +++AT D ATDc -- E ATEn 1 H ATH -- I ATI -- M ATMn 1 O ATO -- 11/22 FEDL 7012-04-01 1 Semiconductor ML7012-04 CMD P Q Style ATP ATQn ATSr ATSr? ATSr = d ATT ATVn S T V Function Initial Value Sets dialing mode to pulse. -- Selects the result code transmission. n = 0: Result code is transmitted. 0 n = 1: Result code is not transmitted. Sets the pointer value for S resistor to "r". -- Echoes back the content of S resistor specified by "r". -- Sets the content of S resistor specified by "r" to "d'. -- Sets dialing mode to DTMF. -- Selects the type of result code. n = 0: Number 1 n = 1: Characters Selects the extended result code and call progress tone detection. n 0 o 1 o 2 o 3 o 4 o Function Line connection 300 bps Result Code CONNECT Note X ATXn -- -- -- -- o o -- -- o o o -- o o -- o o o o o Line connection CONNECT 1200 1200 bps Line connection CONNECT 2400 2400 bps Dial tone detection NO DIAL TONE Busy tone detection BUSY 4 Z &C ATZ AT&Cn &D AT&Dn &G AT&Gn &P AT&Pn Reset in the same way the PDN/RST pin is set to "0". Controls data carrier detection signals (DCD). n = 0: Always sets DCD to ON. n = 1: Controls DCD by detecting reception carriers. Controls the modem in DTR signal state. n = 0: Ignores DTR signals. n = 1: Ignores DTR signals. In data mode, however, moves to on-line command mode when DTR signals change from ON to OFF n = 2, 3: Goes to command mode after disconnecting lines when the change of DTR from ON to OFF is detected during communication. Sets the guard tone transmission. n = 0: No guard tone n = 1: With guard tone of 550 Hz n = 2: With guard tone of 1800 Hz Selects the make rates of pulse dialing. n = 0: 39% (10 pps) n = 1: 33% (10 pps) n = 2: 33% (20 pps) -- 0 2 0 1 12/22 FEDL 7012-04-01 1 Semiconductor ML7012-04 CMD Style &T AT&Tn %E AT%En \L AT\Ln \N AT\Nn \Q AT\Qn \V AT\Vn Function Initial Value Controls the loop back test mode. n = 0: None n = 1: Starts local analog loop back test (ALB) n = 2, 3: None n = 4: Responds to the RDL test requirement -- n = 5: Does not respond to the RDL test requirement n = 6: Starts remote digital loop back test (RDL) n = 7: Starts RDL self-diagnostic test. n = 8: Starts ALB self-diagnostic test. Selects automatic re-training function due to poor incoming conditions of the receive section. 1 n = 0: Automatic re-training is invalid. n = 1: Automatic re-training is valid. Checks the line type and displays the result. n = 0: Checks PBX or direct line. -- n = 1: Checks pulse or tone line. Selects data control mode. n = 0,1: Selects normal mode (without error correction). n = 2-5: None n = 6: Selects reliable mode. Disconnects the line when 7 MNP connection is not available. n = 7: Selects auto-reliable mode. Connects in normal mode when MNP connection is not available. Selects the flow control between DTE and modem. n = 0: No flow control n = 1: None 3 n = 2: None n = 3: Bi-directional control by CTS/RTS Selects extended result code. n = 0: Displays the normal result code. n = 1: Displays the result code with the mode of the MNP 0 connection. n = 2, 3: None Note 13/22 FEDL 7012-04-01 1 Semiconductor ML7012-04 Result Code The result code is returned to DTE after AT command is executed. Two types of result codes are available and can be selected by the Vn command. It is possible to select whether the result code is returned or not by using the Qn command. The format of 2 types of result codes is as follows: In the case of number In the case of characters number CR CR LF Characters CR LF Result Code List Number 0 1 2 3 4 5 6 7 8 10 12 22 23 90 91 92 93 OK CONNECT RING NO CARRIER ERROR CONNECT 1200 NO DIAL TONE BUSY NO ANSWER CONNECT 2400 CONNECT 9600 CONNECT 1200/REL CONNECT 2400/REL EXT DIRECT DTMF PULSE Character String Connected Incoming signal is detected. Aborted the connection or on-hook Found the error in the command Connected at 1200 bps Dial tone cannot be detected. Busy tone is detected. Silence state cannot be detected. Connected at 2400 bps Connected at 9600 bps in normal mode Connected at 1200 bps in MNP mode Connected at 2400 bps in MNP mode Judged as PBX line Judged as a direct line Judged as a tone line Judged as a pulse line Meaning Command is correctly executed. 14/22 FEDL 7012-04-01 1 Semiconductor ML7012-04 REGISTERS S Register Setting In this modem, memory used as S Registers is provided in RAM to set variables used for modem environment settings or to read modem status. Normal operation is not guaranteed when register numbers not specified in this data sheet or parameters outside the specification are input. (1) S register setting The format to set S registers is as follows: AT 15/22 FEDL 7012-04-01 1 Semiconductor ML7012-04 S Register List Refer to the "Bit map S register list" if the function is specified as "Bit map register". Register No. 0 1 2 3 4 5 6 Set Range 0-255 0-255 -- 0-127 0-127 0-127 4-255 Unit time time -- ASCII code ASCII code ASCII code sec Initial Value 0 0 -- 13 10 8 4 Function Setting of the number to receive the ring signal at automatic receive mode. When set to "0", automatic receive function is disabled. The number of receiving rings Not used Carriage return code Line feed code Back space code Pause time from off-hook to start dialing (Only when setting ATX0, X1, and X3) Waiting time for carrier from the far end modem. It is set to on-hook when no carrier is detected after the time specified. Pause time for dialing. It is referred when dial character < , > is used. Not used Carrier lost detection time 10 1-255 1/10 sec 14 It is set to on-hook automatically when the lost of carrier signal is longer than the specified time. Carrier lost detection is invalid when 255 is set. DTMF tone transmit time 11 12 13 14 15 16 17 18 19 20 21 22 23 24 to 27 34* 35* 1-255 -- -- -- -- -- -- 0-255 -- -- -- -- -- -- 0-255 0-255 1/100 sec -- -- -- -- -- -- sec -- -- -- -- -- -- dB dB 9 -- -- 170 -- 0 -- 0 -- -- 18 244 23 -- 2 0 Sets DTMF transmit time. DTMF tone is continuously transmitted when set at 255. Not used Not used Bit map register Not used Bit map register Not used Timer for loop back test Not used Not used Bit map register Bit map register Bit map register Not used Sets the level attenuator of transmit carrier. When 15 to 255 is input, value is fixed to 15. Sets the sending level attenuator of DTMF signal. When 15 to 255 is input, value is fixed to 15. 7 1-115 sec 60 8 9 0-255 -- sec -- 2 -- *Refer to the "Analog Interface Characteristics" for the analog transmit level for S34 and S35. 16/22 FEDL 7012-04-01 1 Semiconductor ML7012-04 Bit Map Register List S14 Bit 7 6 5 4 3 2 1 0 S16 Bit 7 6 5 4 3 2 1 0 S21 Bit 7 6 5 4 3 2 1 0 First value 0 0 0 1 0 0 1 0 Function in 0 setting Does not break DSR signal is always ON. CD signal is always ON. 0 0 Not used Auto re-train disabled Not used &D0 0 1 &D1 Breaks DSR signal operates by ITU-T. CD signal is ON by carrier detection. 1 0 Not used Auto re-train enabled Not used %E &D2 1 1 &D3 Function in 1 setting command Y &S &C &D DTR Control Initial value 0 0 0 0 0 0 0 0 Function in 0 setting Not used Stops analog diagnostic. loop back selfFunction in 1 setting Not used Analog loop back self-diagnostic test loop back self&T8 &T7 &T6 Command Initial value 1 0 1 0 1 0 1 0 Function in 0 setting Answer mode Not used Tone dial Pulse speed 10 pps Makes the result code the number. With the result code No echo back Not used Function in 1 setting Originate mode Not used Pulse dial Pulse speed 20 pps Makes the result code the character string. No result code With echo back Not used T, P &P V Q E Command A, D Stops remote digital loop back self- Remote digital diagnostic. diagnostic test Not used Not used Not used Stops analog loop back test. Not used Not used Not used Stops remote digital loop back test. Remote digital loop back test Analog loop back test &T1 17/22 FEDL 7012-04-01 1 Semiconductor ML7012-04 S22 Bit 7 6 5 4 3 2 1 0 S23 Bit 7 6 5 4 3 2 1 0 Initial value 0 0 0 1 0 1 1 1 0 0 0 0 Function in 0 setting &G0 Parity Even No. 0 1 0 1 &G1 Parity Mark 1 0 1 0 Function in 1 setting &G2 Parity Odd No. 1 1 1 1 &G3 Parity None Command &G Initial value 1 1 1 1 0 1 0 0 0 0 0 0 0 M0 X0 Function in 0 setting Pulse dial make rate 39% 1 0 0 0 1 M1 X1 1 0 1 1 0 M2 X2 Function in 1 setting Pulse dial make rate 33% 1 1 0 1 1 M3 X3 1 1 1 X4 Command &P X Extended command M Not used Not used Not used Not used Not used Not used Not used Not used Not used Not used &T4, &T5 Ignores the remote digital loop back Responds to the remote digital loop request. back request. 18/22 FEDL 7012-04-01 1 Semiconductor ML7012-04 APPLICATION CIRCUITS Analog Interface ML7012 - + AOUT R1 R3 C2 RCI RCAO C1 R2 - + R4 TXAI R5 - + TXAN RA RB ( = RA) R6 600 - + TXAP R7 AIN - + R8 C3 0.022 F 600 : 600 LINE GSR * SG SG Gen. C4 1 F * * The 2nd order LPF should be built to make fc approximately 5 kHz using the built-in amplifier, R1 to R3, and C1 and C2. Numeric examples: R1 = R2 = R3 = 68 k C1 = 1000 pF, C2 = 220 pF When VDD 3 V, R5/R4 2. When VDD < 3 V, R5/R4 1.6. 19/22 FEDL 7012-04-01 1 Semiconductor ML7012-04 Examples of Level Diagram (1) Modem transmit: VDD 3 V AOUT = -20 dBm, RCAO = -20 dBm, TXAN = -14 dBm, TXAP = -14 dBm, LINE = -16 dBm (S34 = 2 dB (initial value), R5/R4 = 2, transformer loss = 2 dB) (2) DTMF transmit: VDD 3 V: high group level The low group levels are approximately 1 dB smaller than the values below. AOUT = -14.5 dBm, RCAO = -14.5dBm, TXAN = -8.5 dBm, TXAP = -8.5 dBm, LINE = -10.5 dBm (S35 = 0 dB (initial value), R5/R4 = 2, transformer loss = 2 dB) (3) Modem transmit: VDD 2.7 V AOUT = -20 dBm, RCAO = -20 dBm, TXAN = -15.9 dBm, TXAP = -15.9 dBm, LINE = -17.9 dBm (S34 = 2 dB (initial value), R5/R4 = 1.6, transformer loss = 2 dB) (4) DTMF transmit: VDD 2.7 V: high group level The low group levels are approximately 1 dB smaller than the values below. AOUT = -14.5 dBm, RCAO = -14.5 dBm, TXAN = -10.4 dBm, TXAP = -10.4 dBm, LINE = -12.4 dBm (S35 = 0 dB (initial value), R5/R4 = -1.6, transformer loss 2 dB) (5) Maximum modem receive: LINE = -9 dBm, connecting point of R6, and R7 = -11 dBm, GSR = -15 dBm (R8/R7 = 0.63 = -4 dB, transformer loss = 2 dB) (6) Minimum modem receive LINE = -40 dBm, connecting point of R6 and R7 = -42 dBm, GSR = -46 dBm (R8/R7 = 0.63 = -4 dB, transformer loss = 2 dB) Connection of Crystal Oscillator Connect a 11.0592 MHz crystal unit and a 1 M feedback resistor between OSC0 and OSC1. The values of capacitors C01 and C02 connected between OSC0 and GND, and OSC1 and GND vary with the load capacitance of the crystal unit and the wiring capacitance of the board. Set the values by the crystal manufacture's matching evaluation. If an external clock is used, input it to OSC0. C01 15 pF OSC0 11.0592 MHz ROSC OSC1 1 M C02 15 pF 20/22 FEDL 7012-04-01 1 Semiconductor ML7012-04 PACKAGE DIMENSIONS (Unit: mm) QFP64-P1414-0.80-BK 5 Notes for Mounting the Surface Mount Type Package Package material Lead frame material Pin treatment Package weight (g) Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (5m) 0.87 TYP. 5/Sept.21,1999 The surface mount type packages are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki's responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). 21/22 FEDL 7012-04-01 1 Semiconductor ML7012-04 NOTICE 1. The information contained herein can change without notice owing to product and/or technical improvements. Before using the product, please make sure that the information being referred to is up-to-date. 2. The outline of action and examples for application circuits described herein have been chosen as an explanation for the standard action and performance of the product. When planning to use the product, please ensure that the external conditions are reflected in the actual circuit, assembly, and program designs. When designing your product, please use our product below the specified maximum ratings and within the specified operating ranges including, but not limited to, operating voltage, power dissipation, and operating temperature. Oki assumes no responsibility or liability whatsoever for any failure or unusual or unexpected operation resulting from misuse, neglect, improper installation, repair, alteration or accident, improper handling, or unusual physical or electrical stress including, but not limited to, exposure to parameters beyond the specified maximum ratings or operation outside the specified operating range. Neither indemnity against nor license of a third party's industrial and intellectual property right, etc. is granted by us in connection with the use of the product and/or the information and drawings contained herein. No responsibility is assumed by us for any infringement of a third party's right which may result from the use thereof. The products listed in this document are intended for use in general electronics equipment for commercial applications (e.g., office automation, communication equipment, measurement equipment, consumer electronics, etc.). These products are not authorized for use in any system or application that requires special or enhanced quality and reliability characteristics nor in any system or application where the failure of such system or application may result in the loss or damage of property, or death or injury to humans. Such applications include, but are not limited to, traffic and automotive equipment, safety devices, aerospace equipment, nuclear power control, medical equipment, and life-support systems. Certain products in this document may need government approval before they can be exported to particular countries. The purchaser assumes the responsibility of determining the legality of export of these products and will take appropriate and necessary steps at their own expense for these. No part of the contents contained herein may be reprinted or reproduced without our prior permission. Copyright 2000 Oki Electric Industry Co., Ltd. 3. 4. 5. 6. 7. 8. 22/22 |
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